TCD-CS-93-19 Lacey G., Waldron R., Dinten J., Lilly F.
Flexible Multi-Sensor Inspection System For Solder-Joint Analysis
Gerard Lacy, Ronan Waldron, Trinity College Dublin, IRELAND
Jean-Marc Dinten, LETI, CEA, Avenue des Martyrs, Grenoble, FRANCE
Francis Lilly, Department of Electronic Engineering, Liverpool John
Moore's University, Liverpool, ENGLAND
This paper describes the design and contruction of an open, automated,
solder bond verification machine for the electronics manufacturing
industry. The application domain is the higher end assembly
technologies, with an emphasis on fine pitch surface mount components.
The system serves a measurement function, quantifying the solder bonds.
It interfaces with the manufacturing process to close the manufacturing
loop. A geometric model of the solder in a joint, coupled with a finite
element analysis of the physical properties of solder, lead to objective
measurement of the solder. Principle illumination systems are laser,
X-ray and noncoherent lighting. Open, Objected Oriented design and
implementation practices enable a forward looking system to be
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